Permabond Adhesives for Electronics
The field of electronics manufacturing is diverse with hundreds of thousands of different applications, many with their own set of individual adhesive requirements. Electronics design engineers regularly face the dual challenge of tracking down the correct adhesive for their application, while also focusing on aspects such as keeping material costs low. Ease of introduction into a production line is also important as this can reduce cycle time while simultaneously improving product performance and quality. It can be a challenging task but Permabond's technical team is ready to help!
Typical Applications:
- Bonding of heat sinks
- Bonding of Surface Mount Devices (SMD's)
- Bonding of exterior plastic housings
- Conformal coatings
- Encapsulation
- Potting
- Wire tacking
Adhesive Key Features
Permabond’s range of adhesives for electronic applications has been carefully selected to offer the user maximum performance in a number of ways.
Permabond’s thermally conductive adhesives are ideal for bonding heat sinks to PCBs. These adhesives have been developed to transfer heat quickly and efficiently away from sensitive electronics, whilst being electrically insulative to prevent short circuits. These adhesive products have been designed with a degree of flexibility to withstand differential thermal expansion and contraction between PCB and heat sink materials.
To be able to survive solder reflow and wave soldering processes, Permabond’s electronics adhesives have been developed to withstand high temperature peaks to match these processing requirements.
The viscosity of Permabond’s potting and encapsulation adhesives has been optimized to ensure electronic components are properly coated and sealed. Permabond’s tack-free conformal coating protects sensitive PCB’s and components against vibration and environmental damage, as well as allowing expansion and contraction of components and therefore minimizing stress on fragile circuitry.
Permabond’s non-“blooming” instant adhesive range, coupled with a special non-flammable activator (which also minimizes blooming) – allows rapid wire tacking and assembly without leaving a white powdery residue on components.
